Fremont, CA, June 12, 1997 - Asyst Technologies, Inc. (NASDAQ:ASYT), the leading supplier of minienvironment and SMIF-based technology to the worldwide semiconductor industry, today announced it has received a major order from Holtek Microelectronics Inc. (Hsinchu, Taiwan). The order, valued at over $4 million, consists of numerous Asyst SMIF-LPTTM (Load Port Transfer) systems for delivery to Holtek's new 8-inch wafer fab -- Fab II. This order represents Holtek's commitment to bringing its Fab II to full-scale integrated circuit (IC) production by January 1998.

The Asyst-SMIFTM systems will enable Holtek to achieve a better-than-Class 1 manufacturing environment in its microcontroller IC production. In addition, the Asyst-SMIF systems will provide Holtek the manufacturing connectivity required to support Holtek's fully-equipped, ultraclean computer integrated manufacturing (CIM) areas. Holtek's plans for Fab II, scheduled for pilot production in October 1997, include reaching 5,000 wafers-per-month output by January 1998 and ultimately reaching an output capacity of 35,000 8-inch wafers per month.

Ling Chen, Holtek's vice president of operations, commented on Holtek's equipment choice for Fab II. "Accelerating from 0 to 35,000 wafers-per-month production within three years requires today's most advanced and proven manufacturing capabilities, and they must be comprehensively supported throughout each level of output advancement," stated Chen. "Based on worldwide acceptance of Asyst's products and our aggressive production program for Fab II, Asyst and their systems were a better choice for our manufacturing requirements."

In addition, Holtek plans to use Asyst-SMIF's ultraclean manufacturing capability to make the migration from 0.5- to 0.25µm design-rule technology. Asyst-SMIF will provide the ultraclean environment enabling Holtek to transition to 0.25µm production without facility upgrades. Asyst reports that the order also incorporates Asyst's SMART-TravelerTM System (STS).

Kenneth Leung, Asyst's vice president of Asia-Pacific operations, explained the importance of supporting current and future technology in the Asia-Pacific region. "Reaching 0.25µm and smaller geometry program objectives is vitally important to the success of the key players in this dynamic marketplace," noted Leung. "Now more than ever, we are seeing the adoption of SMIF manufacturing as a means to boost yield and efficiently speed time-to-market of both current and future products. As with most orders from this region, previous, successful system experience is key to additional purchases," stated Leung.

As the leading supplier of SMIF systems in Taiwan, Asyst reports this order reflects continued strong penetration in the Asia-Pacific region. In fiscal 1997, Asyst's revenues from the Taiwan region increased significantly over the previous year. With many industry analysts predicting that the Asia-Pacific region will produce more than half of the world's semiconductors within the next five years, Asyst is well positioned to capitalize on this emerging region.

About Asyst
Asyst Technologies, Inc. is a leading provider of material handling systems that help semiconductor manufacturers improve their integrated circuit (IC) manufacturing productivity. The company's Asyst-SMIFTM System combines state-of-the-art minienvironments with advanced robotics to create ultraclean processing environments that are both comprehensive and flexible. The SMART-TravelerTM System (STS) works in tandem with SMIF to eliminate misprocessing. Both Asyst-SMIF and its companion STS products are integral to seamless factory automation. Asyst Software, Inc., is dedicated to the development of software products for equipment communications and automated material handling, identification and tracking. Founded in 1984, Asyst Technologies, Inc. is headquartered in Fremont, CA, with facilities in Europe and the Far East. Asyst Software is located in San Jose, CA

About SMIF
SMIF stands for Standard Mechanical InterFace, the material handling approach that enables wafer transfer to and from sealed SMIF environments without exposure to cleanroom ambient conditions. SEMI standards exist for 150- and 200mm wafer sizes and are now being defined for 300mm.