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Press Release

Worldwide
Semiconductor Manufacturing Company (WSMC)
Places $6 Million Order with Asyst Technologies

Asyst extends dominance as sole
SMIF provider in Taiwanese foundry market
Fremont, CA, February 19, 1998 -
Asyst Technologies, Inc. (NASDAQ: ASYT), the leading supplier
of minienvironment and SMIF-based technology to the worldwide
semiconductor industry, today announced it has received a $6
million order from Worldwide Semiconductor Manufacturing Company
(WSMC) (Hsinchu, Taiwan). The order, for multiple Asyst SMIF-LPT (Load
Port Transfer) systems and SMIF-Pods, extends Asyst's dominance
as the sole SMIF provider in the Taiwanese foundry semiconductor
market. Installation of the Asyst-SMIF systems at the WSMC
8-inch foundry fab is scheduled to begin in April 1998.
The newest customer for Asyst, WSMC
is a newly formed joint venture between Winbond Electronics (Hsinchu,
Taiwan) and the Chinese Development Corp. The WSMC facility is
slated to produce various integrated circuits (ICs) with 0.25-micron
design rules, including memories, microprocessors and communication
ICs. According to Asyst, WSMC turned to Asyst's LPTs and Pods
to achieve the better-than-Class 1 processing environments necessary
to reach the facility's production goal of over 30,000 wafers
per month with maximized yields.
Kenneth Leung, Asyst's vice president
of Asia-Pacific sales, commented, "We are established in
Taiwan as the low-risk SMIF solution. WSMC chose us because we
have the breadth of experience to help WSMC ramp-up quickly to
meet their production goals."
Commenting on Asyst's position within
the Taiwanese foundry market, Terry Moshier, Asyst's president
and chief operating officer, said, "Taiwan's semiconductor
foundry industry serves the global market with a broad mix of
microprocessors, logic ICs and DRAMs. The product demands and
SMIF requirements for these Taiwan fabs continue to provide stable
growth for Asyst. We are well positioned to meet capacity expansions
and provide fab upgrades required for this highly competitive
region."
The Asyst LPT resolves the robotics-transfer
(I/O) challenges specific to vacuum loadlock equipment and cluster
tools while improving manufacturing ergonomics and reducing cycle
times by as much as 60 percent. The LPT meets all SEMI standards
and guidelines and integrates SMIF-Pod cassette loading and unloading
into a wide variety of 6- and 8-inch wafer processing tools.
Except for statements of historical
fact, the statements in this press release are forward-looking.
Such statements are subject to a number of risks and uncertainties
that could cause actual results to differ materially from the
statements made. These factors include, but are not limited to,
general economic conditions, semiconductor industry cycles, risks
associated with the acceptance of new products and product capabilities,
and other factors more fully detailed in the Company's most recent
Forms 10-K and 10-Q, and annual report to shareholders.
About Asyst
Asyst Technologies, Inc. is a leading provider of material handling
systems that help semiconductor manufacturers improve their
integrated circuit
(IC) manufacturing productivity. The company's Asyst-SMIF System
combines state-of-the-art minienvironments with advanced robotics to create
ultraclean processing environments that are both comprehensive and flexible.
The SMART-Traveler System (STS) works in tandem with SMIF to eliminate
misprocessing. Both Asyst-SMIF and its companion STS products are integral
to seamless factory automation. Asyst Software, Inc. is dedicated to the
development of software products for equipment communications and automated
material handling, identification and tracking. Founded in 1984, Asyst
Technologies, Inc. is headquartered in Fremont, CA, with facilities in
Europe and the Far East. Asyst Software is located in San Jose, CA
About SMIF
SMIF stands for Standard Mechanical InterFace, the material handling approach
that enables wafer transfer to and from sealed SMIF environments without
exposure to cleanroom ambient conditions. SEMI standards exist for 150,
200 and 300 mm wafer sizes.
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