


Press Release

Asyst
Receives Orders from UMC for New Taiwan Facility

SMIF Technology to be used in new Fab 5. Use
of copper technology poses new challenges
Fremont, CA, September 14, 1999 - Asyst Technologies, Inc.
(Nasdaq NM:ASYT), a leading supplier of advanced manufacturing
solutions for the semiconductor industry, today announced it has
received orders for approximately $8 million in Standard Mechanical
Interface (SMIF) equipment from UMC Group, a leading Taiwanese
foundry. UMC's new 70,000 sq. ft., 200 mm Fab 5, located in Hsinchu
Industrial Park, will produce advanced integrated circuits (ICs)
using interconnect technologies that include copper and aluminum.
The first shipments of Asyst's equipment are expected to begin
this month.
"UMC's decision to incorporate Asyst's SMIF technology in Fab
5 demonstrates that SMIF technology has become the technology of
choice for all the leading foundries in the world, with Asyst as
the leading provider of this technology," said Asyst Chairman and
CEO Mihir Parikh. "Foundries were the first semiconductor manufacturers
to recognize the benefit of our value assurance technology, which
protects the wafer through every step in the manufacturing process.
Asyst now has an installed base that represents most of the world's
major foundries."
UMC's decision to implement copper production presented unique
challenges because of the danger of copper contamination in other
parts of the fab. Since copper contamination can "poison" the transistors
contained in a device, it is critical that copper process facilities
be carefully isolated from other process areas. Asyst worked closely
with UMC to develop solutions, such as advanced SMIF-pods that
will operate only with copper process tools, to help prevent inadvertent
misrouting of wafers that could lead to copper contamination.
According to Chris Chi, senior vice president at UMC, the choice
of Asyst's technology was based on the company's proven track-record
in solving difficult challenges. "We originally used Asyst's SMIF
technology to help us expand capacity in Fab 3, in a very unconventional
manufacturing situation. The success we had with their equipment
led us to decide to design Asyst's SMIF technology into Fab 5 from
the beginning."
"Our initial business with UMC involved overcoming some very unusual
fab manufacturing challenges," said Kenneth Leung, Asyst's vice
president, Asia-Pacific operations. "We have built a strong working
relationship with UMC as a result of both our collaborative efforts
and our locally-based service and support. These were key factors
in helping us win this order."
The UMC Fab 5 order consists of the full range of Asyst-SMIF products,
including: Asyst SMIF-LPTsT and IndexersT for transferring cassettes
into and out of process equipment; SMIF-EnclosuresT or minienvironments
for isolating process equipment; SMART-TagsT for wafer lot tracking;
Asyst SMIF-Pods for encapsulating wafer cassettes; and single-reticle
pods.
Except for statements of historical fact, the statements in this
press release are forward-looking. Such statements are subject
to a number of risks and uncertainties that could cause actual
results to differ materially from the statements made. These factors
include, but are not limited to, general economic conditions, semiconductor
industry cycles, risks associated with the acceptance of new products
and product capabilities and other factors more fully detailed
in the Company's most recent Forms 10-K and 10-Q and annual report
to shareholders.
About Asyst:
Asyst Technologies, Inc. is a leading provider of advanced technologies
designed to protect and enhance customers' valued assets throughout
all phases of the manufacturing process. The company's comprehensive
solutions set includes 200 and 300 mm product families that deliver
state-of-the-art isolation, material management, robotics and
software needed to ensure seamless factory automation in the
most advanced fabs worldwide. Leveraging its value assurance
technologies, Asyst offers OEMs the ability to speed time to
market and reduce development costs, and chipmakers the ability
to achieve greater fab profitability and productivity.
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