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Press Release

Asyst Receives $15-Million Order from SMICChina's First 200mm Foundry

Second Chinese Win Signifies Asyst's Leadership of 200mm
Automation Market
FREMONT, Calif. - June 21, 2001 - Asyst Technologies, Inc.
(Nasdaq NM: ASYT), the leading provider of Standard Mechanical
Interface (SMIF)-based manufacturing automation systems, today
announced it has received an order from China's Semiconductor Manufacturing
International Corp. (SMIC) for its 200mm SMIF products. The order,
totaling more than $15 million, represents Asyst's dominant market-share
leadership of the 200mm SMIF market in the region. The order is
comprised of Asyst's 200mm products, including SMIF load port interfaces
(SMIF-LPTsT), Auto-ID systems (SMART-TagT), wafer cassette containers
(SMIF-Pods) and wafer sorting systems. The SMIC fab-a complete
turnkey operation and the first commercial foundry in China-is
expected to produce more than 85,000 wafers per month when it reaches
full production.
Commenting on the key criteria for selecting a supplier of SMIF
products for its new 200mm foundry, SMIC President and CEO Dr.
Richard Chang stated, "Asyst continues to be the undisputed leader
in its ability to provide us with the comprehensive SMIF products
to equip our fab, and thus the natural choice in our selection.
We know Asyst's excellent reputation around the world, and it can
provide the cost advantage and comprehensive field support that
we require." SMIC has plans to eventually expand its facility to
more than six fabs in Shanghai, and to cooperate and have business
relationships with major semiconductor companies worldwide. Chang
continued, "We look forward to a mutually beneficial and long-lasting
relationship with them as we launch our semiconductor manufacturing
efforts in China."
Semiconductor industry forecasts predict that China will be one
of the fastest growing markets for the industry. Cahners In-Stat
Group (Scottsdale, Ariz.) projected last year that the total device
consumption rate in China is projected to reach $27 billion by
2003. This indicates a strong market opportunity for isolation
and automation technologies, especially as chipmakers and foundries
increasingly depend on these critical technologies to improve productivity
and yield.
According to Asyst Chairman and CEO Dr. Mihir Parikh, "We are
very pleased to have been selected as the SMIF solution supplier
for SMIC's new 200mm fab. This second win in China further strengthens
our leadership position in the rapidly growing Chinese market.
Additionally, our ability to play a leading role in supporting
200mm wafer manufacturing in China positions us strongly to help
our customers transition to the forthcoming 300mm market."
Except for statements of historical fact, the statements in this
press release are forward-looking. Such statements are subject
to a number of risks and uncertainties that could cause actual
results to differ materially from the statements made. These factors
include, but are not limited to: the volatility of semiconductor
industry cycles, failure to respond to rapid demand shifts, dependence
on a few significant customers, the transition of the industry
from 200mm wafers to 300mm wafers, risks associated with the acceptance
of new products and product capabilities, including our Plus Portal
systems, competition in the semiconductor equipment industry, failure
to efficiently integrate acquired companies, failure to retain
employees, and other factors more fully detailed in the Company's
annual report on Form 10-K for the year ended March 31, 2001 filed
with the Securities and Exchange Commission on June 19, 2001.
About Asyst
Asyst Technologies, Inc. is a leading provider of integrated automation systems
for the semiconductor manufacturing industry, which enable semiconductor
manufacturers to increase their manufacturing productivity and protect their
investment in silicon wafers during the manufacture of integrated circuits,
or ICs. Through its "Value-Assured Fab" strategy, Asyst offers a broad range
of 200mm and 300mm solutions that enable the safe transfer of wafers and
information between the process equipment and the fab line throughout the
IC fabrication process, while reducing IC damage caused by human, environmental,
mechanical and chemical factors. Encompassing isolation systems, work-in-process
materials management, substrate-handling robotics, automated transport and
loading systems, and connectivity automation software, Asyst's modular, interoperable
solutions allow chipmakers and original equipment manufacturers, or OEMs,
to select and employ the value-assured, hands-off manufacturing capabilities
that best suit their needs.
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