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Press Release

Asyst Receives $15-Million Order from SMIC—China's First 200mm Foundry


Second Chinese Win Signifies Asyst's Leadership of 200mm Automation Market

FREMONT, Calif. - June 21, 2001 - Asyst Technologies, Inc. (Nasdaq NM: ASYT), the leading provider of Standard Mechanical Interface (SMIF)-based manufacturing automation systems, today announced it has received an order from China's Semiconductor Manufacturing International Corp. (SMIC) for its 200mm SMIF products. The order, totaling more than $15 million, represents Asyst's dominant market-share leadership of the 200mm SMIF market in the region. The order is comprised of Asyst's 200mm products, including SMIF load port interfaces (SMIF-LPTsT), Auto-ID systems (SMART-TagT), wafer cassette containers (SMIF-Pods) and wafer sorting systems. The SMIC fab-a complete turnkey operation and the first commercial foundry in China-is expected to produce more than 85,000 wafers per month when it reaches full production.

Commenting on the key criteria for selecting a supplier of SMIF products for its new 200mm foundry, SMIC President and CEO Dr. Richard Chang stated, "Asyst continues to be the undisputed leader in its ability to provide us with the comprehensive SMIF products to equip our fab, and thus the natural choice in our selection. We know Asyst's excellent reputation around the world, and it can provide the cost advantage and comprehensive field support that we require." SMIC has plans to eventually expand its facility to more than six fabs in Shanghai, and to cooperate and have business relationships with major semiconductor companies worldwide. Chang continued, "We look forward to a mutually beneficial and long-lasting relationship with them as we launch our semiconductor manufacturing efforts in China."

Semiconductor industry forecasts predict that China will be one of the fastest growing markets for the industry. Cahners In-Stat Group (Scottsdale, Ariz.) projected last year that the total device consumption rate in China is projected to reach $27 billion by 2003. This indicates a strong market opportunity for isolation and automation technologies, especially as chipmakers and foundries increasingly depend on these critical technologies to improve productivity and yield.

According to Asyst Chairman and CEO Dr. Mihir Parikh, "We are very pleased to have been selected as the SMIF solution supplier for SMIC's new 200mm fab. This second win in China further strengthens our leadership position in the rapidly growing Chinese market. Additionally, our ability to play a leading role in supporting 200mm wafer manufacturing in China positions us strongly to help our customers transition to the forthcoming 300mm market."

Except for statements of historical fact, the statements in this press release are forward-looking. Such statements are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include, but are not limited to: the volatility of semiconductor industry cycles, failure to respond to rapid demand shifts, dependence on a few significant customers, the transition of the industry from 200mm wafers to 300mm wafers, risks associated with the acceptance of new products and product capabilities, including our Plus Portal systems, competition in the semiconductor equipment industry, failure to efficiently integrate acquired companies, failure to retain employees, and other factors more fully detailed in the Company's annual report on Form 10-K for the year ended March 31, 2001 filed with the Securities and Exchange Commission on June 19, 2001.

About Asyst
Asyst Technologies, Inc. is a leading provider of integrated automation systems for the semiconductor manufacturing industry, which enable semiconductor manufacturers to increase their manufacturing productivity and protect their investment in silicon wafers during the manufacture of integrated circuits, or ICs. Through its "Value-Assured Fab" strategy, Asyst offers a broad range of 200mm and 300mm solutions that enable the safe transfer of wafers and information between the process equipment and the fab line throughout the IC fabrication process, while reducing IC damage caused by human, environmental, mechanical and chemical factors. Encompassing isolation systems, work-in-process materials management, substrate-handling robotics, automated transport and loading systems, and connectivity automation software, Asyst's modular, interoperable solutions allow chipmakers and original equipment manufacturers, or OEMs, to select and employ the value-assured, hands-off manufacturing capabilities that best suit their needs.

 


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