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Press Release

Asyst
and TSMC Team on Next-Generation 300mm Automation Solution

Strategic Collaboration to Expand Capabilities of Asyst's
FasTrack AMHS for High-capacity Intrabay Applications
Fremont, CA, September 11, 2001 - Further demonstrating
its pioneering role in 300mm technology, Asyst Technologies, Inc.
(Nasdaq NM: ASYT) today announced it is collaborating with Taiwan
Semiconductor Manufacturing Co. (TSMC) on a strategic 300mm fab-transport
development project. Under the agreement, Asyst, the leading provider
of Standard Mechanical Interface (SMIF)-based manufacturing automation
systems, will team with TSMC, one of the world's leading semiconductor
foundries, to expand the capabilities of Asyst's FasTrack automated
material handling system (AMHS). The companies' shared goal is
to optimize the product for TSMC's cutting-edge 300mm manufacturing
vision.
The aggressive four-month project timetable includes key milestones
aimed at allowing TSMC to fully optimize Asyst's vehicle-less,
continuous-flow transport (CFT) system to meet TSMC's critical
300mm automation objectives: increased capacity, reduced lot-delivery
time and maximized tool utilization. The project calls for Asyst
to provide TSMC with a FasTrack transport system, which will be
installed initially at Asyst's facility in Taichung, Taiwan, to
facilitate the joint development work. Extensive performance testing
will be conducted to integrate the FasTrack system's ability to
significantly increase tool utilization and fab throughput. Like
product yield enhancement, proven via Asyst's SMIF technology,
these factors represent the next principal "levers" in fab productivity
and profitability.
Commenting on the cooperative effort between the two companies,
C.H. Hung, TSMC's Department Manager of 300mm Manufacturing, stated, "Asyst
has an established track record of working closely with TSMC to
understand our critical requirements, and they are a proven leader
in addressing the innate challenges associated with manufacturing
and handling of costly 300mm wafers. We are pleased to be working
with Asyst on this important project that will have a profound
effect on the future of 300mm AMHS and manufacturing."
Dr. Mihir Parikh, Asyst's chairman and CEO, noted, "Asyst is deeply
committed to optimizing our leading technology to meet the needs
of IC foundries, which have the industry's most demanding material
transport, storage and equipment micro-stocking/buffering requirements.
Through this intensive development project, we look forward to
enhancing the capabilities of our innovative FasTrack system so
that it is fully optimized for TSMC's current and future 300mm
automation requirements.
Except for statements of historical fact, the statements in this
press release are forward-looking. Such statements are subject
to a number of risks and uncertainties that could cause actual
results to differ materially from the statements made. These factors
include, but are not limited to: the volatility of semiconductor
industry cycles, failure to respond to rapid demand shifts, dependence
on a few significant customers, the transition of the industry
from 200mm wafers to 300mm wafers, risks associated with the acceptance
of new products and product capabilities, including our Plus Portal
systems, competition in the semiconductor equipment industry, failure
to efficiently integrate acquired companies, failure to retain
employees, and other factors more fully detailed in the Company's
annual report on Form 10-K for the year ended March 31, 2001 filed
with the Securities and Exchange Commission on June 19, 2001, as
amended.
About Asyst
Asyst Technologies, Inc. is a leading provider of isolation and automation
technologies that enable semiconductor makers to protect their valued assets
throughout the manufacturing process while increasing manufacturing productivity.
Through this "Value-Assured Fab" strategy, Asyst offers a broad range of
200mm and 300mm solutions that enable the safe transfer of wafers and information
between the process equipment and the fab line throughout the IC fabrication
process, preventing human, environmental, mechanical and chemical harm. Encompassing
robotics, portals, wafer and reticle carriers, connectivity and interface
products, and transport and loading products, Asyst's modular, interoperable
solutions allow chipmakers and original equipment manufacturers (OEMs) to
select and employ the value-assured, hands-off manufacturing capabilities
that best suit their needs.
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