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 Press Release

Asyst
Technologies Signs Definitive Agreement To Form Joint Venture
With Shinko Electric Co. Ltd. Of Japan
 FREMONT,
Calif., May 24, 2002 - Asyst Technologies, Inc. (NASDAQ NM: ASYT),
a leading provider of integrated automation solutions that maximize
semiconductor manufacturing productivity, today announced that it
has signed a definitive agreement related to its previously announced
planned joint venture with Shinko Electric Co. Ltd. of Japan.
Under
the terms of the agreement, Asyst will acquire 51% interest in
a new joint venture company, Asyst Shinko Inc. The new company
will contain the market-leading automated material handling systems
(AMHS) business of Shinko Electric, which will retain 49% ownership
of the new entity. Asyst will pay 8.16 billion Yen for its share,
at a rate equivalent to 1.34 times Shinko's AMHS sales for the
year ended March 31, 2002. The transaction is expected to close
on October 1, 2002, after the completion of Shinko's current
six-month fiscal reporting period.
Asyst currently is exploring multiple options for funding the
transaction, including bank debt in Japan. The company is continuing
the commercialization
program for its proprietary AMHS technology, called FasTrack, which uses
revolutionary continuous-flow technology to transport semiconductor wafers
within a fab. Asyst anticipates that, upon closing, the Asyst Shinko and FasTrack
engineering and sales teams will work cooperatively to offer customers the
industry's only dual-technology, optimized wafer transport and tool loading
solution.
Shinko
has won more than half of the current worldwide installations
for 300mm AMHS, including the two largest installations to date
-- the first production 300mm fab for a large U.S.-based chip
manufacturer and the first production 300mm fab for Taiwan Semiconductor
Manufacturing Co. (TSMC, NYSE:TSM). Shinko's 300mm installed
base is the largest in the industry and includes more than 21.8
kilometers of track, 970 various transport vehicles and nearly
200 stockers.
About Asyst: Asyst
Technologies, Inc. is a leading provider of integrated automation
solutions that enable semiconductor manufacturers to increase
manufacturing productivity and protect investments in silicon
wafers during the manufacture of integrated circuits, or ICs.
The company offers a broad range of 200mm and 300mm solutions
that enable the safe transfer of wafers and information between
process equipment and the fab line throughout the IC fabrication
process, while reducing IC damage caused by human, environmental,
mechanical and chemical factors. Encompassing isolation systems,
work-in-process materials management, substrate-handling robotics,
automated transport and loading systems, and connectivity automation
software, Asyst's modular, interoperable solutions allow chipmakers
and original equipment manufacturers, or OEMs, to select and
employ the value-assured, hands-off manufacturing capabilities
that best suit their needs. Asyst's homepage is http://www.asyst.com
About
Shinko Electric Co. Ltd: Shinko Electric Co., Ltd. was
founded in 1917. The company is a Japan based major manufacturer
of electric machinery and precision electronic equipment, offering
its outstanding and unique Electronics & Mechatronics technologies
to customers worldwide. The company has four key business units:
Information Systems, Infrastructure Systems, Aerospace Devices
and Automated Material Handling Systems. In addition to its
leadership in 300mm semiconductor AMHS, the company also is
a leading manufacturer of photographic color printers and compact
linear swing motors. Headquartered in Tokyo, Shinko has 2,500
employees.
Safe
Harbor: Except for statements of historical fact, the statements
in this press release are forward-looking. Such statements
are subject to a number of risks and uncertainties that could
cause actual results to differ materially from the statements
made. These factors include, but are not limited to, general
economic conditions, semiconductor industry cycles, risks associated
with the acceptance of new products and product capabilities
and other factors more fully detailed in the Company's recent
10Q quarterly report on file with the Securities and Exchange
Commission.
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