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 Press Release

Asyst
Names Daniel E. Hoffman As Vice President, Manufacturing

FREMONT,
Calif., June 13, 2002 - Asyst Technologies, Inc. (Nasdaq
NM: ASYT), a leading provider of integrated automation solutions
that maximize semiconductor manufacturing productivity, today
announced that it has named Daniel E. Hoffman to the position
of Vice President, Fab Solutions Operations, reporting to Fred
Tiso, Senior Vice President, Manufacturing Operations.
Hoffman, who
has over 14 years of experience in high technology manufacturing,
was most recently vice president, surface mount platform systems/operations,
for Universal Instruments Corporation (UIC), where he led volume
manufacturing for their flagship SMT equipment products. His
achievements there included the implementation of lean manufacturing,
improvement of supply chain productivity, and high growth performance.
He reduced factory work-in-process by nearly 70% while increasing
output two-fold. Subsequent lead times were reduced by more than
80%, all while driving a 71% increase in business unit revenues.
Prior to joining
UIC, Hoffman was vice president, operations, for the Advanced
Substrate Technology and Interconnects business unit of Honeywell
Electronic Materials (formerly AlliedSignal EM), where he established
start-up operations, implemented 6-sigma initiatives and led
key acquisition integration efforts. Hoffman received a bachelor
of science degree in chemistry/biochemistry from Eastern Washington
University.
About Asyst: Asyst
Technologies, Inc. is a leading provider of integrated automation
solutions that enable semiconductor manufacturers to increase
manufacturing productivity and protect investments in silicon
wafers during the manufacture of integrated circuits, or ICs.
The company offers a broad range of 200mm and 300mm solutions
that enable the safe transfer of wafers and information between
process equipment and the fab line throughout the IC fabrication
process, while reducing IC damage caused by human, environmental,
mechanical and chemical factors. Encompassing isolation systems,
work-in-process materials management, substrate-handling robotics,
automated transport and loading systems, and connectivity automation
software, Asyst's modular, interoperable solutions allow chipmakers
and original equipment manufacturers, or OEMs, to select and
employ the value-assured, hands-off manufacturing capabilities
that best suit their needs. Asyst's homepage is http://www.asyst.com
Safe
Harbor: Except for statements of historical fact, the statements
in this press release are forward-looking. Such statements
are subject to a number of risks and uncertainties that could
cause actual results to differ materially from the statements
made. These factors include, but are not limited to, general
economic conditions, semiconductor industry cycles, risks associated
with the acceptance of new products and product capabilities
and other factors more fully detailed in the Company's recent
10Q quarterly report on file with the Securities and Exchange
Commission.
CONTACT:
Investor Contact
John Swenson
Asyst Technologies, Inc.
(510) 661-5000
jswenson@asyst.com
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