FREMONT, Calif.-June 27, 2002 - Asyst Technologies, Inc. (Nasdaq NM: ASYT), a leading provider of integrated automation solutions that maximize semiconductor manufacturing productivity, today announced that it has made volume shipments of its new G3 CoolCase™ front-opening unified pod (FOUP) wafer carrier to a major North American microelectronics manufacturer in fulfillment of a multimillion-dollar order. With these shipments, Asyst is now positioned as the leading supplier of 300mm wafer carriers to more than three-fourths of the world's current production 300mm fabs.

The new G3 CoolCase was developed to meet new standards for improved protection from fire and smoke propagation in 300mm fabs. The new standards address concerns raised by insurance providers and chip manufacturers regarding the fire and smoke propensity of materials used in FOUP wafer carriers, which are used by the thousands to store, transport and process 300mm wafers in newer, multibillion dollar fabs. Asyst developed and qualified the new fire and smoke retardant material used to manufacture the
G3 CoolCase. In addition, the new G3 CoolCase addresses concerns regarding visibility of the wafers and process segregation control by introducing transparent color segregation options with this new product release.

Wayne Nobles, vice president and general manager of Asyst's Wafer and Reticle Carrier Group, said, "This CoolCase demonstrates Asyst's continued commitment to technology advancements and operational excellence by providing leading-edge system solutions to 300mm customers. The most meaningful accolades are those received from our customers, and it is a significant honor to have been selected as the best-of-breed supplier by this industry leader. Such recognition underscores our leadership in the 300mm FOUP market and acknowledges our company's success in providing a variety of automation products to leading chipmakers worldwide."

Building on Asyst's early-generation 300mm FOUPs, the G3 CoolCase is fully compatible with all other Asyst 300mm product offerings. Also integrated into the new CoolCase are transport grooves designed to facilitate high-speed transport on next-generation automated material handling systems (AMHS), such as Asyst's FasTrack™, which is based on the company's unique continuous-flow technology.

Except for statements of historical fact, the statements in this press release are forward-looking. Such statements are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include, but are not limited to, general economic conditions, semiconductor industry cycles, risks associated with the acceptance of new products and product capabilities and other factors more fully detailed in the Company's recent 10Q quarterly report on file with the Securities and Exchange Commission.

About Asyst: Asyst Technologies, Inc. is a leading provider of integrated automation solutions that enable semiconductor manufacturers to increase manufacturing productivity and protect investments in silicon wafers during the manufacture of integrated circuits, or ICs. The company offers a broad range of 200mm and 300mm solutions that enable the safe transfer of wafers and information between process equipment and the fab line throughout the IC fabrication process, while reducing IC damage caused by human, environmental, mechanical and chemical factors. Encompassing isolation systems, work-in-process materials management, substrate-handling robotics, automated transport and loading systems, and connectivity automation software, Asyst's modular, interoperable solutions allow chipmakers and original equipment manufacturers, or OEMs, to select and employ the value-assured, hands-off manufacturing capabilities that best suit their needs. Asyst's homepage is http://www.asyst.com

CONTACT:
Investor Contact

John Swenson
Asyst Technologies, Inc.
(510) 661-5000
jswenson@asyst.com