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 Press Release

Asyst
expands capabilities of leading connectivity software to
meet industry's most advanced 300MM manufacturing requirements
 FREMONT, Calif.-November 14, 2002 - Asyst
Technologies, Inc. (Nasdaq: ASYT), today introduced enhancements
that enable its GW Associates GWconX300" software to solve
communications challenges associated with wafer fabrication equipment
that uses an internal buffer or mini-stocker, instead of an external
load port, to process front-opening unified pods (FOUPs) full of
300mm wafers. This represents a new market opportunity for Asyst,
enabling the company to extend its market-leading position in OEM
tool connectivity software.
GWconX300 was originally designed to handle the manufacturing-communications
requirements of fixed-buffer equipment, in which a load port bolted
onto the outside of the tool interfaces with an automated material-handling
system (AMHS) to load FOUPs back and forth for processing. While
about 90 percent of semiconductor-manufacturing tools utilize this
kind of structure, a small but critical percentage of equipment,
including such tools as diffusion furnaces and wet benches, contains
internal buffers. These systems, which intake, process and store
FOUPs via a FOUP buffer or mini-stocker, essentially include part
of the AMHS within the equipment and, therefore, require much more
complicated software to address internal connectivity challenges.
"Our goal in adding these enhancements to GWconX300
was twofold," said Paula LuPriore, vice president/general
manager, Connectivity Solutions at Asyst Technologies. "First,
it is our goal to make GWconX300 the de facto industry standard
for advanced 300mm tool connectivity, and it is therefore, important
that the product be capable of running on all tools in a fab. Second,
since internal-buffer-based systems do not use our load ports,
this new capability provides an entrée into these markets
and an opportunity to expand our 300mm technology reach."
GWconX300 is software for implementing communications
links on semiconductor wafer fabrication equipment, using the new
Semiconductor Equipment and Materials International (SEMI) standard
protocols required for all 300mm and advanced 200mm factory-automation
systems. It provides run-time software libraries designed for incorporation
with the embedded control software of any type of 300mm equipment.
GWconX300 also provides tools for rapid development and integration
of connectivity software. Key features include automated handling
of intercompatibility between new SEMI standards; field-configurable
adjustments that ensure compatibility of equipment with older legacy
host computers; automatic process, syntax checks and replies to
all messages mandated by the specified SEMI standard; and hooks
for synchronization with the SEMI E84 standard, which ensures a
smooth handshake between production equipment and the AMHS. Currently
in beta testing, the enhanced version of GWconX300 will be in production
volume by the first quarter of next year. More information about
Asyst's 300mm connectivity solutions will be presented at a workshop
on December 5, at the Makuhari Prince Hotel, from 1:00-6:00 p.m.
to coincide with SEMICON Japan 2002. Asyst also will be demonstrating
its 300mm hardware and software solutions in its booth #7-B301
at SEMICON Japan, December 4-6, at the Makuhari Messe Exhibition
Center, Chiba, Japan.
Except for statements of historical fact, the statements
in this press release are forward-looking. Such statements are
subject to a number of risks and uncertainties that could cause
actual results to differ materially from the statements made. These
factors include, but are not limited to, general economic conditions,
semiconductor industry cycles, risks associated with the acceptance
of new products and product capabilities and other factors more
fully detailed in the Company's recent 10Q quarterly report on
file with the Securities and Exchange Commission.
About Asyst
Asyst Technologies, Inc. is a leading provider of integrated automation solutions
that enable semiconductor manufacturers to increase manufacturing productivity
and protect investments in silicon wafers during the manufacture of integrated
circuits, or ICs. The company offers a broad range of 200mm and 300mm solutions
that enable the safe transfer of wafers and information between process equipment
and the fab line throughout the IC fabrication process, while reducing IC
damage caused by human, environmental, mechanical and chemical factors. Encompassing
isolation systems, work-in-process materials management, substrate-handling
robotics, automated transport and loading systems, and connectivity automation
software, Asyst's modular, interoperable solutions allow chipmakers and original
equipment manufacturers, or OEMs, to select and employ the value-assured,
hands-off manufacturing capabilities that best suit their needs. Asyst's
homepage is http://www.asyst.com
GWconX300 is a trademark of Asyst Technologies, Inc.
CONTACT:
Investor Contact
John Swenson
Asyst Technologies, Inc.
(510) 661-5000
(510) 661-5166 (fax)
jswenson@asyst.com
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