FREMONT, Calif.—November 21, 2002—Asyst Technologies, Inc. (Nasdaq: ASYT), a leading provider of integrated automation solutions designed to maximize semiconductor manufacturing productivity, today announced that a leading global silicon wafer manufacturer has placed a large production order for Asyst’s G3 front-opening unified pod (FOUP) wafer carriers. The protection of raw silicon wafers is a new market for Asyst.
Following an in-depth evaluation of multiple FOUP suppliers, the customer selected Asyst’s FOUPs to replace open carriers for 300mm wafer manufacturing at its current and future facilities. Asyst won the business based on its ability to quickly meet the customer’s unique requirements while providing all the standard benefits of the market-leading G3 FOUP. The FOUP shipments will commence this quarter with deliveries slated over the next two years.

The customer’s decision to upgrade to the Standard Mechanical Interface (SMIF) technology utilized in Asyst’s FOUPs represents a significant shift for the silicon wafer-manufacturing sector. Until the advent of 300mm, there was no compelling need for these companies to switch to SMIF from open wafer carriers because at smaller diameters, the base wafers were less susceptible to physical damage and contamination. With the shift to 300mm comes changes in semiconductor manufacturing practices, which when combined with the wafers’ physical size and fragility created the need to migrate to FOUPs.

Commenting on the wafer manufacturer’s inaugural order, Wayne Nobles, Asyst’s vice president/general manager, Wafer and Reticle Management Solutions said, “We are extremely pleased to receive this order for the G3 from one of the world’s leading silicon wafer manufacturers. As the leader in isolation technology for more than a decade, it is truly exciting to see our products gain acceptance in a new and important market.”

Asyst is focused on assuring worldwide availability of its 300mm FOUPs via its recently announced manufacturing outsourcing agreement with Solectron, which is the only two-time winner of the Malcolm Baldrige National Quality Award. As the transition to 300mm wafer manufacturing accelerates, Asyst’s relationship with Solectron will ensure that Asyst can meet the anticipated wide demand for a full line of 300mm automation solutions.

About Asyst
Asyst Technologies, Inc. is a leading provider of integrated automation solutions that enable semiconductor manufacturers to increase manufacturing productivity and protect investments in silicon wafers during the manufacture of integrated circuits, or ICs. The company offers a broad range of 200mm and 300mm solutions that enable the safe transfer of wafers and information between process equipment and the fab line throughout the IC fabrication process, while reducing IC damage caused by human, environmental, mechanical and chemical factors. Encompassing isolation systems, work-in-process materials management, substrate-handling robotics, automated transport and loading systems, and connectivity automation software, Asyst’s modular, interoperable solutions allow chipmakers and original equipment manufacturers, or OEMs, to select and employ the value-assured, hands-off manufacturing capabilities that best suit their needs. Asyst’s homepage is http://www.asyst.com

CONTACT

Investor Contact:

John Swenson
Asyst Technologies, Inc.
(510) 661-5000
(510) 661-5166 (fax)
jswenson@asyst.com

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