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Fab Upgrades
Although the transition to 300mm is well underway, Asyst believes that many fab
operators for the next several years will continue to make "life extension"
investments in their 200mm fabs, adding capacity or new technologies that spur
the need for additional automation solutions.
Working closely with IC manufacturing customers around the world, Asyst provides
the technology and products needed to build custom fab upgrades utilizing
its standard mechanical interface (SMIF) mini-environments and automation
technologies. Asyst's innovation and proven know-how help global chipmakers
upgrade from non-SMIF to SMIF technology or add next-generation manufacturing
technologies at reduced cost and with minimum risk.
Extend Existing Fab Useful Life
- Upgrading fabs with Asyst's SMIF isolation technology can be done while
maintaining existing non-SMIF wafer production.
- Ramp is done in parallel with new or retrofit SMIF 200mm process tools.
- Improves time to market of new IC Technologies by accelerating qualification
lots.
- Extends life of existing facility 2-3 design rules by significantly improving
wafer environment control and eliminating human-wafer exposure and handling.
- Asyst solutions enable cost-effective shrinks below 0.15 micron and are
key for processing at 0.13 micron and below, extending a fab's useful life.
Maximum Productivity & Profitability
- Maximizes advantages of SMIF isolation. Asyst's SMIF products
protect wafers and reticles from environmental and handling damage, removing
variances that often destabilize manufacturing. SMIF-Pods™ and load
ports provide the best protection available for wafers during storage,
transport and process tool interfacing.
- Maximizes die yield. Asyst's SMIF isolation technology
reduces defect densities and improves die yields by providing the wafers with
superior protection from the variabilities of the cleanroom and operator handling.
Automated SMIF wafer sorters
enforce the new "hands-off" handling discipline.
- Maximizes line yield. The SMART-Traveler™
System helps to ensure that wafers and reticles are at the right equipment
at the right time, eliminating or significantly reducing misrouting and mis-processing
and reducing scrap.
- Improves operator productivity and equipment effectiveness.
Asyst's SMIF and SMART-Traveler manufacturing solutions create a proven
platform for improving fab equipment automation, enabling "Place and
Go"
tool loading operations and helping fab operators achieve their highest productivity
levels.
Proof Point
Payback for an Asyst fab upgrade project typically takes 6-12 months. Yield
benefits from 3-10% can be achieved, depending on die size and design rules,
without the disruption of production that other methods require.
Learn More About Specific Products
To learn more about how Asyst can optimize fab upgrades, see Equipment
Solutions, Fab Solutions and
Connectivity Solutions. To learn
more about specific products refer to:
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