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Substrate
Management System™ (SMS)
Asyst's Substrate Management System (SMS) gives chipmakers maximum
IC wafer manufacturing control. It is a fully-automated, host controlled
wafer management tool that maintains a Sub-class 1 environment during
critical handling operations such as lot creation, verification, splits,
merges, send-aheads, transfers, randomization, lot compression, incident
recovers, and test wafer management. The system improves yields and
productivity in 300mm and 200mm configurations.
Maximum Productivity & Profitability
- Improves yields
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Reduces handling-induced scratches and contamination. |
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Offers randomized or wafer-to-slot position tracking. |
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Provides Sub-Class 1 mini-environment performance |
- Increases productivity
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Provides wafer level verification of material
integrity (OCR, T7, BCR). |
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Provides randomization or wafer-to-slot position tracking. |
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Provides automated tracking of all splits, merges
and send-aheads. |
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GEM 300 compliant. |
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Uses an intuitive Windows NT-based Graphical User Interface
(GUI). |
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Guarantees the safe, rapid transfer of 1, 2, or 5 wafers
per robot move. |
- Compliant with 300mm SEMI standards, including E40, E87, E90,
and E94.
- SMS systems are available in 2, 3, and 4 I/O configurations.
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